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  1. product.skhynix.com › products › dramDDR | SK hynix

    SK Hynix First 128-Layer NAND Consumer PCle NVMe SSD Related Material. Select Application. table for product spec finder. Results Export All to Excel.

  2. product.skhynix.com › products › dramHBM3 | SK hynix

    HBM3 | SK hynix Official Product Website. product detail World’s First HBM3 Developed in October 2021 In just 15 months since launching HBM2E mass production, SK hynix solidified its leadership in high-speed DRAM by developing an HBM3, the latest in high-bandwidth memory for cutting-edge technologies across datacenters, supercomputers, and AI.

  3. Jun 8, 2023 · About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea ...

  4. About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally.

  5. Jan 31, 2023 · Seoul, February 1, 2023. SK hynix Inc. (or ‘the company’, www.skhynix.com) reported today financial results for 2022 ended on December 31.The company recorded revenues of 44.648 trillion won, an operating profit of 7.007 trillion won and a net income of 2.439 trillion won.

  6. product.skhynix.com › products › dramLPDDR4X/4 | SK hynix

    SK hynix’s broad portfolio of low-power DRAM including LPDDR4 and LPDDR4X is found not only in smartphones, but also in the wide spectrum of consumer electronics from digital cameras to portable gaming and navigation devices, and even automotive infotainment and Advanced Driver Assist Systems. Customizable to Device Needs

  7. Apr 24, 2024 · SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana News Highlights To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University… April 3, 2024

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