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Intel shows off its next-gen Lunar Lake, Xeon 6, Guadi 3 chips at Hot Chips 2024 Share on Reddit. Intel at Hot Chips 2024: Lunar Lake has over 20% more MT, ST performance than Meteor Lake Share on Reddit. Cerebras gives waferscale chips an inferencing twist • The Register.
1:45PM-3:15PM. Tutorial 2: The Cooling of Hot Chips: How thermal technology is keeping up with the AI revolution Chair: Seshu Madhavapeddy, Frore Systems. Thermal techniques for higher data center compute density. Tom Garvens, Supermicro. Next-generation cooling for NVIDIA’s Accelerated Computing.
Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley.
Welcome to Hot Chips 2023 Program. Natalia Vassilieva (Cerebras) Heiner Litz (UC Santa Cruz) Hot Chip 2023 (Aug 27 – 29, 2023) 1. Hot Chips 2023 Program Committee. Ralph Wittig, Xilinx/AMD Pradeep K Dubey, Intel Priyanka Raina, Stanford Jae W. Lee, SNU Forest Baskett, Nea Mark D. Hill, Microsoft Alan Smith, UC Berkeley Ashkan Seyedi, Nvidia ...
At Hot Chips 2024, discover how our groundbreaking Parallel Processing Unit (PPU) technology can deliver up to 100x performance boost for future superCPUs. Meet our co-founders Dr. Martti Forsell (CTO), Timo Valtonen (CEO), and Jussi Roivainen (Chief Designer) to explore the future of general purpose computing.
Hot Chips 2023. 35th Hot Chips Conference. HC35 => HC2023. 1st in-person Hot Chips in 4 years. 1st in Dinkelspiel auditorium. Limited to 500 seats, sold out!
Abstract: This tutorial will focus on the evolution of hypervisors, their interactions with servers and I/O chips. Specifically, it will cover the architecture of the modern Nitro hypervisor and Nitro chips for the AWS infrastructure, including the Nitro networking, storage and HPC chips.
HOPPER H100 TENSOR CORE GPU. 80B Transistors, TSMC 4N. 2nd Gen Multi-Instance GPU Confidential Computing PCIe Gen5. 4th Gen Tensor Core Thread Block Clusters. 132 SMs 2x Performance per Clock. New Memory System World’s First HBM3 DRAM. New SHARP support NVLink Network. Larger 50MB L2. 4th Gen NVLink 900GB/s total BW.
Hexagon NPU. Processor executing 3 instruction sets: Scalar: For control flow and general purpose. Vector: General purpose data-parallel compute. Tensor: Matrix multiply and convolutional layer.
Hot Chips 34 (2022) The Hot Chips Conference is usually held during the latter half of August near Stanford, California. **Early Registration: is CLOSED.** Early Registration Ends: 11:59 PM (PDT) Friday, August 6, 2021. Last Day for Refunds: 11:59 PM (PDT) Wednesday, August 18, 2021.
