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Jun 26, 2024 · The powertrain business area of Continental Vitesco Technologies, and ROHM Semiconductor, have signed a development partnership, in June 2020. Vitesco Technologies will use SiC components to further increase the efficiency of its power electronics for electric vehicles
Jun 26, 2024 · ROHM has developed Hall ICs, the BD5310xG-CZ / BD5410xG-CZ series, designed for automotive applications requiring magnetic detection. In recent years, the continuing computerization of vehicle systems to meet the demand for increasing electrification and functionality along with greater comfort and safety has required additional ECUs (Electronic Control Units) and sensors to provide control.
Jun 26, 2024 · During the existing development partnership with ROHM the relevant SiC chips were further optimized for use in automotive inverters starting in 2024. "The supply partnership agreement with ROHM is an important building block for securing Vitesco Technologies' SiC capacities in the years ahead," said Andreas Wolf, CEO of Vitesco Technologies, at the signing ceremony in Regensburg.
Jun 26, 2024 · May 21 st, 2021. Aiming to achieve zero carbon and zero emissions by 2050. ROHM’s ‘Environmental Vision 2050’ contributes to achieving a sustainable society by 2050. In addition to pursuing zero carbon and zero emissions (zero CO2 emissions) based on the three themes of ‘climate change’, ‘resource recycling’, and ‘coexistence ...
Jun 26, 2024 · The ROHM group company LAPIS Technology has developed the industry's first speech synthesis ICs - ML22120xx series (ML22120TB, ML22120GP) - designed for AVAS in xEVs (electric vehicles). Attention to Internet Explorer users: ROHM website does not recommend browsing in IE 11.
Jun 11, 2024 · ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of TRCDRIVE pack™ products.
Jun 26, 2024 · Nuremberg/Willich – April 25th, 2023: Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules. Recently, Semikron Danfoss added ROHM’s new 1200V RGA IGBT to its low power module offering.
